Part Number: IVC-3D51111; Model: IVC-3D51111; Product Name: SICK IVC-3D Series 3D Image Vision System
Brand: SICK (SICK AG, a global leader in sensor technology and industrial automation solutions, renowned for high-precision, reliable vision systems, sensors, and safety technology for industrial applications worldwide)
Product Status: Industrial-Grade Original Equipment (In-Stock, Factory Calibrated); Product Category: Integrated 3D Vision System, combining 3D image capture, data processing, and analysis functions in one compact unit, designed for high-precision 3D inspection, measurement, and recognition tasks in industrial automation.
Core Application: Widely used in automotive manufacturing (body part positioning, welding seam inspection, component assembly verification), electronic component production (PCB height measurement, semiconductor packaging inspection), logistics and material handling (palletizing verification, object dimensioning), and robotics (pick-and-place positioning, bin picking guidance). Ideal for scenarios requiring non-contact 3D measurement, real-time defect detection, and high-precision spatial recognition in harsh industrial environments.
Core Features: Integrated 3D laser triangulation technology for high-precision data acquisition; Built-in industrial-grade processor for real-time 3D data processing; Seamless integration with industrial robots, PLCs, and automation systems; Support for multiple 3D inspection modes (dimension measurement, profile analysis, volume calculation); User-friendly configuration software with intuitive operation interface; Compact and robust design adapting to industrial installation; Comprehensive data communication interfaces; Compliance with international industrial safety and EMC standards.
2. Core Performance Specifications (Ta = 25℃, Unless Otherwise Specified)
2.1 3D Vision Performance Parameters
Measurement Principle: Laser Triangulation; Detection Range (Z-Axis): 50mm - 500mm (Adjustable), X-Axis Field of View: 80mm - 400mm (Depending on Working Distance), Y-Axis Scanning Length: Up to 1000mm (Optional Extension);
3D Resolution: X/Y-Axis: ≤0.1mm, Z-Axis: ≤0.05mm; Measurement Accuracy: ±0.1mm (Full Measurement Range); Scanning Speed: Up to 500 Profiles per Second, Frame Rate: 30 FPS (Maximum at Full Resolution);
Laser Source: Class 2 Laser (Visible Red, Wavelength: 650nm), Output Power: ≤1mW, Eye-Safe Design; Image Sensor: CMOS Sensor, Pixel Size: 3.75μm × 3.75μm, Effective Pixels: 2048 × 1536;
Data Processing: Built-in FPGA + ARM Processor, 3D Point Cloud Processing Speed: ≥1 Million Points per Second, Support for Point Cloud Filtering, Smoothing, and Feature Extraction Algorithms.
2.2 Communication & Interface Parameters
Communication Protocols: Ethernet/IP, PROFINET IO, Modbus TCP, UDP/TCP, and SICK Proprietary Protocol; Seamless compatibility with major industrial PLCs (Siemens, Allen-Bradley, Mitsubishi) and robot controllers (KUKA, FANUC, ABB);
Communication Interfaces: 2×Gigabit Ethernet Ports (10/100/1000Mbps, Auto-Negotiation, RJ45), 1×USB 3.0 Port (For Data Export and Configuration), 1×RS232 Port (For Debugging and Maintenance);
Digital I/O: 8×Digital Input (DI, 24V DC, Optically Isolated, Response Time ≤1ms), 8×Digital Output (DO, 24V DC, Max 0.5A Per Channel, Optically Isolated); Trigger Mode: External Hardware Trigger, Software Trigger, and Continuous Scanning Mode;
Data Output: 3D Point Cloud Data (PLY, CSV Format), Measurement Results (Coordinate Values, Dimension Data), Defect Detection Signals, and Status Information.