Part Number: 0024105677G1812; Model: XRTC PCB Assembly; Product Name: Mettler Toledo XRTC Series Precision Industrial PCB Assembly
Brand: Mettler Toledo (Mettler Toledo International Inc., a global leader in precision measurement instruments and industrial automation components, renowned for high-reliability electronic assemblies, weighing systems, and process control solutions for industrial, pharmaceutical, laboratory, and food & beverage applications worldwide)
Product Status: Industrial-Grade Original Component (Factory Calibrated & Tested, In-Stock); Product Category: Custom High-Precision PCB Assembly, engineered as a core control unit for Mettler Toledo XRTC series weighing equipment, integrating advanced signal processing, data transmission, and intelligent fault diagnosis functions.
Core Application: Exclusively compatible with Mettler Toledo XRTC series precision balances, industrial process scales, and laboratory weighing systems. Widely applied in pharmaceutical dosing & quality control, chemical process weighing, food hygiene measurement, and industrial process monitoring. Essential for scenarios demanding ultra-high precision signal conversion, anti-interference data processing, and seamless integration with high-sensitivity load cells and host control systems.
Core Features: High-TG FR-4 substrate with excellent thermal stability and corrosion resistance; Enhanced signal integrity design for minimal transmission loss; Seamless compatibility with XRTC series sensors and controllers; Multi-layer protection against ESD, overvoltage, short circuit, and electromagnetic interference; Precision impedance control for high-speed data transmission; Halogen-free and RoHS-compliant materials; Factory pre-calibrated to ensure direct integration and weighing accuracy.
2. Core Performance Specifications (Ta = 25℃, Unless Otherwise Specified)
2.1 Electrical Performance Parameters
Operating Voltage: 5V DC ±5% (Nominal), 12-36V DC Wide Voltage Option (For Industrial Applications); Operating Current: ≤120mA (Typical), ≤180mA (Maximum Load);
Signal Conversion Accuracy: ±0.005% FS (Full Scale) for Weighing Signal; Signal Input: Differential Analog Signal (From Load Cells, 0-15mV); Signal Output: Digital Signal (RS485/Modbus RTU, Ethernet Optional), 4-20mA Analog Output (Optional);
Data Processing Speed: ≥200 Samples per Second; Frequency Response: 0.05Hz-2kHz (Adjustable); Impedance Control: 120Ω (RS485 Communication), 50Ω (High-Speed Signal Lines) with ±7% Tolerance;
Insulation Resistance: ≥200MΩ (500V DC), Dielectric Strength: 1.5kV AC for 1 Minute (No Breakdown, No Arcing); Dielectric Constant (DK): 4.2±0.2 (1GHz) for Substrate Material.
2.2 PCB Design & Component Parameters
PCB Substrate: FR-4 High-TG Material (TG ≥170℃), Halogen-Free, Flame Retardant (UL94 V-0); PCB Layers: 4 Layers (Dual Signal Layers, Power Layer, Ground Layer) with optimized stack-up for anti-interference;
Board Dimensions: 115mm × 75mm × 1.6mm (Length × Width × Thickness); Minimum Line Width/Spacing: 4.0mil / 4.0mil; Minimum Drilling Aperture: 6mil (Mechanical Drill), 0.1mm (Laser Drill for Blind Holes);
Surface Treatment: Electroless Nickel Immersion Gold (ENIG) for All Pads (Enhanced Wear Resistance), Copper Thickness: 1oz (35μm) for Signal Layers, 2oz (70μm) for Power/Ground Layers; Component Mounting: SMT (Surface Mount Technology) for Precision Components, Through-Hole Mounting for Connectors;
Key Components: High-Precision Operational Amplifiers (ADI), 18-Bit Resolution ADC (Analog-to-Digital Converter), ESD Protection Diodes (±25kV Air Discharge), Metal Oxide Varistors (MOV) for Overvoltage Protection, Embedded NTC Temperature Sensor for Thermal Compensation.