Part Number: 949-823-01/B; Model: LA823; Product Name: Teradyne LA823 Industrial Test Board
Brand: Teradyne (A Global Leader in Automatic Test Equipment, Specializing in Semiconductor Test Systems, Industrial Automation Test Solutions, and Electronic Manufacturing Test Platforms)
Product Status: Original Industrial-Grade Test Component (In Stock for Semiconductor Test Systems, Electronic Manufacturing Automation, and Industrial Control Test Projects); Product Category: High-Precision Analog/Digital Hybrid Test Board, Designed for Integration into Teradyne Automatic Test Equipment (ATE) Systems.
Core Application: Widely integrated into Teradyne semiconductor test systems, electronic component test platforms, and industrial control device verification setups. It is mainly used for signal conditioning, high-precision measurement, and I/O interface expansion in the testing process of integrated circuits, printed circuit boards (PCBs), and industrial electronic modules, ensuring accurate and reliable test results.
Core Features: High-Precision Analog Signal Processing; Multi-Channel I/O Interface; Industrial-Grade Circuit Design; Compatibility with Teradyne ATE Systems; Built-In Fault Detection; Stable Signal Transmission; Compact Form Factor for System Integration; Anti-Interference Performance for Harsh Test Environments.
2. Core Performance Specifications (Ta = 25℃, Unless Otherwise Specified)
2.1 Electrical Performance Parameters
Operating Voltage: ±15V DC ±5% (Analog Circuit), +5V DC ±3% (Digital Circuit); Power Consumption: ≤18W (Under Rated Operating Conditions); No-Load Current: Analog Circuit ≤300mA, Digital Circuit ≤500mA;
Analog Signal Performance: Input/Output Channels: 8 Differential Analog Channels; Signal Range: ±10V DC (Adjustable via Software); Resolution: 16 Bits; Sampling Rate: Up to 1MHz per Channel;
Digital I/O Performance: 16 Digital Input/Output Ports (Optically Isolated); Logic Level: TTL/CMOS Compatible (Selectable); Response Time: ≤100ns; Drive Capacity: 20mA per Port;
Signal Accuracy: Analog Input Error: ≤±0.01% FSR; Analog Output Ripple: <5mVpp; Digital Signal Jitter: ≤10ns; Crosstalk Attenuation: ≥80dB@1MHz.
2.2 Interface & Communication Parameters
Communication Interfaces: 1x High-Speed Serial Interface (RS-422, Full-Duplex), 1x Local Bus Interface (Compatible with Teradyne ATE System Bus), 2x BNC Connectors (for Analog Signal Input/Output);
Protocol Support: Teradyne Proprietary Communication Protocol, Compatible with ATE System Control Protocol; Serial Communication Speed: Up to 115.2kbps (RS-422);
Expansion Interface: 1x Expansion Header for Optional Function Modules (Signal Conditioning, Isolation Modules); Test Interface: Screw-Terminal Connectors (Digital I/O), BNC (Analog Signals), Board-to-Board Connector (System Integration);
Diagnostic Interface: Built-In LED Indicators (Power, Signal Status, Fault Alarm), Support for System-Level Fault Diagnosis via ATE Control Software, Real-Time Signal Monitoring.
3. Hardware Configuration & Mechanical Parameters
3.1 Hardware Configuration
Cooling System: Passive Convection Cooling (Optimized for Rack-Mounted ATE Systems); Indicator Lights: Power Indicator (Green), Signal Normal Indicator (Blue), Fault Alarm Indicator (Red);
Protective Functions: Overvoltage Protection (±25V for Analog Ports), Overcurrent Protection (50mA per Digital Port), ESD Protection (±15kV Contact, ±25kV Air), Short-Circuit Protection for Output Ports;
Core Components: High-Precision ADC/DAC Chips, Industrial-Grade Logic Controller, Isolation Circuits, EMI Filtering Modules; Built-In Self-Test (BIST) Function for Hardware Integrity Verification.
3.2 Mechanical & Installation Parameters
Dimensions (W × D × H): 160mm × 100mm × 20mm (6.30 inches × 3.94 inches × 0.79 inches, Excluding Connectors); Mounting Type: Rack-Mounted (Compatible with Teradyne ATE System Chassis), Screw-Fixed Installation;
Weight: ≤0.3kg (Net Weight); Housing Material: FR-4 Reinforced Circuit Board with Anti-Corrosion Coating, Metal Shielding Cover for EMI Protection; Protection Grade: IP20 (Suitable for Indoor Test Equipment Cabinets);
Terminal Type: Locking Screw Terminals (Digital I/O), BNC Connectors (Analog Signals), Board-to-Board Pin Header (System Bus); Fixing Method: Anti-Vibration Design to Resist Industrial Test Environment Vibration and Shock.