Part Number: USP-II i-3V; Model: USP-II i-3V; Product Name: THEMIS USP-II i-3V Industrial Control Board
Brand: THEMIS (A Professional Manufacturer of Industrial Control Components, Specializing in High-Stability Control Boards, Signal Processing Modules and Integrated Automation Solutions for Harsh Environments)
Product Status: Original Industrial-Grade Component (In Stock for Military, Aerospace and Industrial Automation Project Deployment); Product Category: High-Reliability 3V-Level Control Board, Designed for Precision Motion Control and System Coordination Applications.
Core Application: Widely integrated into unmanned ground vehicles (UGVs), military automation systems, precision instrumentation, aerospace auxiliary equipment, and harsh-environment industrial control systems. It serves as the core unit for signal acquisition, command execution, power management and multi-module coordination between sensors, actuators and upper-level controllers.
Core Features: 3V Low-Voltage Stable Operation; High Anti-Interference Performance; Robust EMI/RFI Shielding Design; Built-In Fault Self-Diagnosis and Alarm Function; Industrial-Grade Components for Extreme Environment Adaptability; Seamless Compatibility with THEMIS Automation Ecosystem and Third-Party Peripherals.
2. Core Performance Specifications (Ta = 25℃, Unless Otherwise Specified)
2.1 Electrical Performance Parameters
Operating Voltage: 3.0V DC ±5% (Low-Voltage Power Supply for Control and Signal Circuits); Auxiliary Power Output: 3.3V DC/5V DC (Selectable via Jumper, Maximum Output Current 1A); Total Power Consumption: ≤8W (Under Rated Operating Conditions);
Signal Processing Speed: Up to 800kHz Reference Clock Frequency; Data Transmission Rate: 1Gbps (Gigabit Ethernet Interface), 9600-115200 bps (Serial Interfaces); Signal Delay: <10μS (Digital Signal Transmission);
A/D Conversion Performance: 16-Bit Resolution, 12 Single-Ended Input Channels, Conversion Speed 8μS per Channel; Input Signal Range: 0~3V, ±1.5V (3V-Level Optimized, Selectable via Software);
Digital I/O Performance: 8 Channels Digital Input (DI), 6 Channels Digital Output (DO), TTL Level (3V Compatibility) with Latch Function; Count/Timer: 4 Channels 16-Bit Counter/Timer, Support External Trigger, Timing Interrupt and Pulse Width Modulation (PWM).
2.2 Interface & Communication Parameters
Communication Interfaces: Gigabit Ethernet (RJ45 Port, Compatible with IEEE 802.3/IEEE 802.3U), RS-232C, RS-485 (Half-Duplex/Full-Duplex Selectable), Fiber Optic Interface (Optional); Protocol Support: TCP/IP, Modbus RTU, CANopen (DS402), THEMIS Proprietary Communication Protocol;
Actuator Interface: Digital Differential Interface (Dedicated for THEMIS Servo Modules and Actuators), Pulse Train Command Output (Position/Velocity Control, 3V-Level Signal);
Sensor Interface: Analog Input (for Thermocouple, Thermistor, Pressure Sensors and Weak 3V-Level Signals), Digital Input for Proximity Sensors, Limit Switches and Encoders; TTL 5V Single-Pulse External Signal Trigger Interface (Compatible with 3V System);
Expansion Interface: PCIe Mini Slot (1x Lane, Compliant with Industrial Standards), 2x I2C Interfaces, 1x SPI Interface, Support for Front-End Signal Processing Modules and Custom Expansion Cards for Extended Functionality.
3. Hardware Configuration & Mechanical Parameters
3.1 Hardware Configuration
Cooling System: Passive Convection Cooling (Adapted to Sealed Cabinet and Harsh Environment); Indicator Lights: Power Indicator (Green), Run Status Indicator (Blue), Fault Alarm Indicator (Red), Communication Status Indicator (Yellow);
Protective Functions: Overvoltage Protection, Undervoltage Protection, Short-Circuit Protection, Overheating Protection, ESD Protection (±15kV Contact, ±25kV Air), Signal Interference Suppression, Fault Self-Diagnosis and Alarm Output;
Component Grade: Military-Grade Integrated Circuits and Capacitors, Wide Temperature Range Optimization; Signal Processing: Built-In High-Precision Low-Pass Filter, Noise Suppression Circuitry and Signal Isolation Module for Stable Transmission in Complex Environments.
3.2 Mechanical & Installation Parameters
Dimensions (W × D × H): 120mm × 90mm × 25mm (4.72 inches × 3.54 inches × 0.98 inches, Excluding Bracket); Mounting Type: DIN Rail Mount (35mm Standard DIN Rail) or Panel Mount (Optional, Anti-Vibration Bracket Included);
Weight: ≤0.4kg (Net Weight); Housing Material: FR-4 Circuit Board with Anti-Corrosion and Anti-Moisture Coating, Metal Shielding Case for EMI/RFI Protection; Protection Grade: IP30 (Adaptable to Dust and Mild Moisture Environments);
Terminal Type: Gold-Plated Pin Headers and Locking Connectors (Ensuring Low Contact Resistance, Stable Connection and Anti-Vibration Performance); Fixing Method: Stainless Steel Screws, Anti-Vibration Design for Mobile and Harsh Industrial Environments.